An explanation and demo of atomic layer deposition (ALD) of copper metal on glass. Precursors are copper(I) chloride and hydrogen, processed in a hot-wall tube quartz tube furnace.
10 torr operating pressure
500 sccm argon sweep/purge gas constantly flowing
75 sccm CuCl argon pulse gas (17 seconds including flow controller lag)
100 sccm H pulse gas (14 seconds including flow controller lag)
7 second purge time between pulses
100mm quartz tube furnace diameter
415*C deposition temperature
350*C CuCl evaporation temperature
Substrates are mostly borosilicate glass cleaned with RCA clean
The "good" samples shown in the video are about 750 cycles (about 9 hours
Main ref:
https://sci-hub.se/https://doi.org/10.1002/cvde.19970030107
Also helpful:
https://sci-hub.se/https://doi.org/10.1063/1.5087759
https://sci-hub.se/10.1149/2.0261501jss
https://sci-hub.se/https://doi.org/10.1016/0022-0248(92)90191-K
Alicat flow controller manuals (hard to find via website navigation):
https://documents.alicat.com/manuals/DOC-MANUAL-MC.pdf
https://documents.alicat.com/manuals/old/Gas_Flow_Controller_Manual_rev7.pdf
https://documents.alicat.com/Alicat-Serial-Primer.pdf
RCA clean: https://en.wikipedia.org/wiki/RCA_clean
CuCl synthesis: http://wwwchem.uwimona.edu.jm/lab_manuals/c1901exp35.html
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